Thermoplastic ultra-low transmission loss film 'BeLight' <low dielectric properties>
Super low dielectric with a dielectric constant of 2.2! Using lower-cost materials compared to current low dielectric materials.
The thermoplastic ultra-low transmission loss film "BeLight" is a high-speed communication material that achieves both ultra-low dielectric properties and high adhesion to copper foil. With a dielectric constant of 2.2 and a dielectric loss tangent of 0.0004@28GHz (SNL type), it features low transmission loss equivalent to that of fluoropolymer materials. It uses lower-cost materials compared to current low-dielectric materials, such as LCP or PTFE. It can be used both as an adhesive for FFC and as a substrate, allowing for the reduction of dielectric properties in the insulating part (adhesive + substrate) when using this product. 【Features】 ■ Dielectric constant of 2.2, dielectric loss tangent of 0.0004@28GHz (SNL type) ■ Low transmission loss comparable to or better than fluoropolymer materials ■ Low water absorption (<0.1%) *For more details, please download the PDF or feel free to contact us.
- 企業：三菱ケミカル 工業・メディカルフィルムズセールスグループ
- 価格：Other
